COURSES

CHIP LEVEL SERVICE TRAINING SINCE THE YEAR "1999"

Phase 1: Fundamentals & Hand Skills (Days 1–7)

Day 1: Basic Electronics (Theory) – Introduction to Ohm’s Law, series and parallel circuits, and basic components (resistors, capacitors, diodes, transistors).
Day 2: Multimeter Mastery – Practical training on identifying components and measuring voltage, continuity, and resistance.
Day 3: Power Supply (DC Machine) – Using a DC power supply to detect short circuits (full/half shorts) and understanding boot sequences through current readings.
Day 4: Assembly & Disassembly – Techniques for opening modern smartphones safely, removing screens, and organizing internal hardware.
Day 5: Soldering Basics – Proper handling of a soldering iron, applying flux, and soldering charging jacks and microphones.
Day 6: SMD Rework Station – Introduction to the hot air station; removing and replacing small SMD components (LDOs, coils) without damaging the PCB.
Day 7: Oscilloscope (DSO) – Basics of signal checking on the PCB; measuring data lines and clock signals to diagnose complex boot failures.

Phase 2: Advanced Hardware & IC Reballing (Days 8–13)

Day 8: Schematic Analysis (Borneo) – Introduction to Borneo Schematics; using Hardware Solutions, Bitmap, and PDF Schematics to trace circuits.
Day 9: Intermediate Soldering – Micro-jumpering techniques for repairing broken PCB tracks and bypasses.
Day 10: IC Chip Reballing (Power IC) – Removing black/white glue, cleaning IC pads, and reballing using stencils and solder paste.
Day 11: Reballing Practice (eMMC/CPU) – Advanced reballing techniques for larger chips like eMMC and standard CPU modules.
Day 12: Dead Phone Diagnosis – Using a combination of the DC machine, Borneo Schematics, and multimeter to find "No Power" causes.
Day 13: Liquid Damage Repair – Advanced cleaning procedures using ultrasonic cleaners and localized PCB repair for corrosion.

Phase 3: eMMC Programming & Software (Days 14–17)

Day 14: Introduction to Easy JTAG Plus – Hardware setup, installing drivers, and connecting to the Easy JTAG Plus interface.
Day 15: eMMC Health & Boot Repair – Checking eMMC health (life cycle), reading/writing dump files, and repairing boot-loop issues.
Day 16: Advanced Easy JTAG – ISP Pinout (In-System Programming) for connecting to boards without removing ICs; FRP bypass and partition repair.
Day 17: UFS & Data Recovery – Basics of UFS storage technology and recovering user data from dead or partially functioning devices.

Phase 4: Advanced Troubleshooting & Live Repair (Days 18–20)

Day 18: Sectional Troubleshooting – Deep dive into fixing specific sections: No Power , Display/Backlight, Charging, Network/RF, and Audio.
Day 19: High-level demonstration of removing and reballing CPUs , Emmc , Ufs , Power Ic , Network Ic
Day 20: Short Killer Usage , Live Practicals , Infra Red Thermal Camera Usage , Live Practicals Etc...

Phase 1: Hardware Basics & OS Deployment (Days 1–5)

Day 1: Desktop & Laptop Architecture – Identification of internal components: CPU, VRM sections, RAM slots, Chipsets (PCH), and I/O ports.
Day 2: Card Level Assembly – Step-by-step assembly of a PC; laptop teardown and reassembly techniques for different brands (Dell, HP, Lenovo).
Day 3: OS Installation & Drivers – Creating bootable media; BIOS/UEFI settings; installing Windows/Linux; driver management and backup.
Day 4: Storage & RAM Upgrades – Cloning HDD to SSD (SATA/NVMe); RAM compatibility (DDR3/4/5); troubleshooting Blue Screen of Death (BSOD).
Day 5: Physical Repairs – Laptop screen replacement (EDP/LVDS cables); hinge repair

Phase 2: Basic Electronics & Soldering Skills (Days 6–10)

Day 6: PC Electronics Foundations – Understanding resistors, capacitors (SMD/Electrolytic), MOSFETs, and diodes in the context of computer logic.
Day 7: Multimeter Mastery – Using the Fluke or similar multimeter for "Cool Testing" (Resistance/Continuity) and "Hot Testing" (Voltage).
Day 8: Soldering & Desoldering – Safe removal of through-hole components and basic SMD soldering using a temperature-controlled iron.
Day 9: SMD Rework Station – Techniques for removing multi-pin ICs (I/O chips, BIOS chips) using hot air without melting nearby plastic connectors.
Day 10: DC Power Supply (LPS) – Using a DC machine to inject voltage into a motherboard to find short circuits through heat detection or thermal cameras.

Phase 3: Motherboard Sections & Schematics (Days 11–15)

Day 11: Introduction to Schematics – Reading laptop "Blueprints" and Boardview files using tools like OpenBoardView.
Day 12: Power Sequences (G3 to S0) – Tracing the "Power-On" sequence; understanding how a laptop moves from "Plugged In" to "Fully On."
Day 13: 19V/Charging Section – Tracing the main power rail (VIN/B+), charging ICs, and battery charging circuits.
Day 14: VRM & CPU Power – Troubleshooting the 3.3V/5V standby rails and the CPU Core voltage section.
Day 15: RAM & PCH Sections – Tracing voltage for RAM and the PCH (Platform Controller Hub); identifying "No Display" faults.

Phase 4: Advanced Tracing & Troubleshooting (Days 16–20)

Day 16: Signal Tracing & Oscilloscope – Using a Digital Storage Oscilloscope (DSO) to check CLK (Clock) signals and BIOS communication (SPI).
Day 17: BIOS Programming – Using a CH341A or RT809F Programmer to backup, clear ME Region, and re-flash corrupted BIOS chips.
Day 18: Fault Finding (Logic) – Systematically diagnosing "Dead," "No Display," and "Auto Power Off" conditions.
Day 19: Advanced Chip Level – MOSFET bypass techniques, repairing corroded traces, and introduction to BGA reballing for GPU/Chipsets.
Day 20: Final Assessment – Live troubleshooting of a "Dead" Pc & laptop motherboard using schematics and the multimeter &oscilloscope.